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发明名称
METHOD OF BONDING LEAD
摘要
申请公布号
JPH11177230(A)
申请公布日期
1999.07.02
申请号
JP19970345280
申请日期
1997.12.15
申请人
SHIMADZU CORP
发明人
INOUE KOJI;KANAMARU NORIAKI;SATO HIDEKI
分类号
H05K3/34;(IPC1-7):H05K3/34
主分类号
H05K3/34
代理机构
代理人
主权项
地址
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