| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED chip capable of making even a small-sized LED chip wireless without the danger of short-circuiting and obtaining an extremely thin semiconductor light emitting element and a manufacturing method. SOLUTION: The LED chip 10 is composed of a substrate 1, a light emitting layer formation part 12 formed by providing a semiconductor layer 2 on the substrate 1, a coating layer 3 composed of insulating transparent resin provided on the outer periphery of the light emitting layer formation part 12 and a pair of electrodes 4 and 5 respectively provided on the back surface of the substrate 1 and the surface side of the light emitting layer formation part 12. Thus, since the boundary part of the p-type layer and n-type layer of a semiconductor layer part is coated with a translucent insulator, even when the LED chip 10 is laid fallen and mounted on the substrate and the electrodes 4 and 5 on both sides are electrically connected by a conductive adhesive material directly on the substrate, the danger of short-circuiting between both electrodes does not exist. |
