| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable nimbly and easily lamination loading work of a ring frame to a frame feeding part in the automatic sticking device of a semiconductor wafer. SOLUTION: An adhesive tape T drawn out of a tape roll is stuck on the under side of a ring frame F which is fed to a tape sticking position to cut out the sticked adhesive tape T along the ring frame F, and then the ring frame F with the adhesive tape stuck thereon is carried to a wafer-stuck position for sticking a wafer W on the adhesive tape T of the ring frame F. In this constitution, a frame feeding bogie 42 transferable of laminatedly held ring frame F is arranged to be pushed into and pulled out of a frame feeding part, while a lifting device receiving the lamination ring frame F group on the push-carried in frame feeding bogie 42 for lift-up feeding is arranged inside the frame feeding part.</p> |
