发明名称 ELECTROSTATIC CHUCK DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide an electrostatic chuck device, which is enhanced in electrostatic force by decreasing the insulating dielectric layer of an electrostatic chuck part in volume resistivity, restrained from deteriorating in release performance when a voltage is stopped from being supplied, prevented from contaminating a semiconductor device with impurities, provided with an insulating dielectric layer free from fine cracks or pores, and satisfactory in withstand voltage characteristic. SOLUTION: In an electrostatic chuck device, a voltage is applied to a conductor electrode 1 coated with an insulating dielectric layer 2 to enable the insulating dielectric layer 2 to electrostatically chuck a specimen, wherein the main component of the insulating dielectric layer 2 is a sintered body, which is formed in a manner where 2.5 to 5 wt.% TiO2 and 5 wt.% or less TiN powder are added to high-resistance ceramic powder the volume resistivity of which is higher than 1×10<14>Ω.cm, the mixture is kneaded, molded, and baked into a sintered body the volume resistivity of which is set at 1×10<8> to 8×10<13>Ω.cm.</p>
申请公布号 JPH11176920(A) 申请公布日期 1999.07.02
申请号 JP19970362824 申请日期 1997.12.12
申请人 SHIN ETSU CHEM CO LTD 发明人 ARAI KENICHI;KUBOTA YOSHIHIRO
分类号 B23Q3/15;H01L21/683;H02N13/00;(IPC1-7):H01L21/68 主分类号 B23Q3/15
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