| 摘要 |
PROBLEM TO BE SOLVED: To improve joint strength of an electronic part, and to improve reliability. SOLUTION: A resistor 2 formed of RuO system materials is formed on an aluminum substrate 1, and a conductor 3 made of Cu conductor materials is formed by a prescribed wiring pattern. An overcoat glass layer 4 is print- formed on the resistor 2 and the conductor 3. A land 3b faced to a bump electrode for a flip chip is formed on the conductor 3. An electronic part (a part other than a flip chip) such as a chip capacitor is joined on a land 3a with conductive adhesive 5, and a flip chip 8 is joined on the land 3b by welding 7. Also, a resin layer (under resin) 9 made of epoxy resin is packed between the flip chip 8 and the aluminum substrate 1. |
