| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of resin sealed semiconductor device with high reliability in which no void nor wire flow is caused and no chipping is caused in the mold, and to provide the device adopting the method. SOLUTION: In the manufacture of a resin sealed semiconductor device, a gate block 8 with a resin injection path having a wide resin injection port is placed to one corner from four corners of a cavity 9 acting as a resin mold package region and bent blocks 10-1, 10-2, 10-3 having a resin flow-out path are placed to the remaining three corners. Then the flow of the resin from the resin injection/flow-out path is controlled by rotating the bent blocks 10-1, 10-2, 10-3. |
