| 摘要 |
PROBLEM TO BE SOLVED: To prevent exposure onto a package surface of a structure in a package by installing a lead section electrically connected to a semiconductor element and a flow regulating section guiding a flow of a resin when the lead section and the semiconductor element are sealed with resin, and to compose the lead section and the flow regulating section of the same member. SOLUTION: A semiconductor chip 21 is mounted and fixed on the lead frame 22 by a polyimide tape 23. A flow regulating member 32 unified with the lead frame 22 is formed by machining the lead frame 22. The semiconductor chip 21 side from the frame 22a of the frame is used as leads 24 for connection by wire bonding. The flow regulating member 32 is formed by integral molding with the lead frame 22, and shaped so as to be projected from the frame 22b of the lead frame 22 to the side, where the semiconductor chip 21 is arranged. Accordingly, movement of the semiconductor chip 21 can be inhibited, and trouble that the semiconductor chip 21 and the leads 24 float can be prevented. |
