| 摘要 |
PROBLEM TO BE SOLVED: To obtain an element easy to wire-bond plural optical integrated elements and capable of constituting it as a single part even when it is used for one package by arranging plural optical integrated elements in the package in the mounted state and connecting the electrode pads of the respective optical integrated elements to the terminals of the package through a conductive pattern of a substrate. SOLUTION: Plural optical integrated elements 11 are arranged in the same package 5 in the state being mounted on a substrate 6 having the same conductive pattern 51. Then, the electrode pads of the optical integrated elements 11 are constituted to be connectable to an inner lead part Q of the package 5 through the conductive pattern 51 of the substrate 6 by wire bonding. Thus, bonding of metallic thin lines 53, 55 at the time of the wire bonding is facilitated and plural optical integrated elements 11 can be arranged in the same package. Heat radiation can be performed excellently by using the substrate arranging an excellent heat conductive material on its rear surface as the substrate 6 having the conductive patter 51. |
