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发明名称
METHOD AND APPARATUS FOR FORMING SILICON WAFER
摘要
申请公布号
JPH11176752(A)
申请公布日期
1999.07.02
申请号
JP19970339130
申请日期
1997.12.09
申请人
NEC CORP
发明人
TANABE HIROSHI
分类号
H01L21/205;H01L21/20;H01L21/26;H01L21/268;(IPC1-7):H01L21/20
主分类号
H01L21/205
代理机构
代理人
主权项
地址
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