发明名称 BURN-IN APPARATUS FOR NON-CONTACT IC CARD
摘要 PROBLEM TO BE SOLVED: To provide a burn-in apparatus, which performs burn-in of a non- contact IC card in a completed state, wherein a circuit section and an induction coil are connected and mounted on an IC-card substrate in the non-contact IC card. SOLUTION: A non-contact IC card is mounted on a conductive coil 1 of a burn-in apparatus comprising an insulating substrate 2 and one or two or more conductive coils 1 provided in approximately the same surface as the insulating substrate 2, so that the flat surface of the IC card is overlapped on the surface of the insulating substrate 2. A current is made to flow through the conductive coil 1. Thus, an induced current is generated in the induction coil built in the non-contact IC card. The current is carried through the induction coil and an internal circuit that is connected to the induction coil.
申请公布号 JPH11176894(A) 申请公布日期 1999.07.02
申请号 JP19970341230 申请日期 1997.12.11
申请人 MITSUBISHI ELECTRIC CORP;MITSUBISHI DENKI SYSTEM LSI DESIGN KK 发明人 MURASAWA YASUHIRO
分类号 H01L21/66;G06F11/24;G06K17/00 主分类号 H01L21/66
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