| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board in which dispersion of the thickness and disconnection of thin-film wiring conductor layers are prevented effectively. SOLUTION: A wiring board is made by laminating alternately an organic- resin insulating layer 2 and a thin-film wiring conductor layer 3 to form a multilayer structure, and by mutually connecting top and bottom lying thin-film conductor layers 3 by through-hole conductors 9 filled in through holes 8 formed in each organic-resin insulating layer 2. Through-hole conductor 9 consists of a first material member 9a plated on inside wall of the through hole 8 and a second material member 9b placed inside of the first material member 9a and having Vickers hardness of lower than 50. |
