BALL GRID ARRAY PRINTED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a ball grid array BGA semiconductor device having a resin layer which encapsulates a semiconductor element and with high connection reliability. SOLUTION: This semiconductor device is provided with a BGA printed circuit board 2 on the backside of which pole electrodes 4 are placed in an array form, a semiconductor element 1 that is mounted on a major side of the BGA printed circuit board, and a resin layer 3 that encapsulates the semiconductor element and is placed on a major side of the BGA printed circuit board. Ball electrodes included in a resin layer on a backside and placed on the backside of the BAG printed circuit board include first ball electrodes placed inward from a resin layer outer circumference 5 which is in contact with a major side of the BGA printed circuit board and second ball electrodes placed at the outside of the resin layer outer circumference 5. A placing inhibit region where no ball electrodes are placed is in existence between the first pole electrodes and second pole electrodes.