| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor module whose reliability is high. SOLUTION: A conductive heat radiating plate 4 to which an insulating substrate 1 on which a semiconductor element 3 is loaded is adhered and fixed is partially provided with a notched part, and this notched part is filled with resin 9 whose thermal conductivity is high. Also, the position of the notched part is provided outside the area on which semiconductor element 2 is mounted. Thus, the surface destruction of the semiconductor element 2 can be prevented without sacrifying radiation of the heat radiating plate 4. Also, the injection port of silicon gel 6 packed in a case 5 for housing the semiconductor element 2 and the insulating substrate 1 on which this is loaded is sealed (8) by a film having moisture impermeability and flexibility. Thus, the moisture prevention of the silicon gel 6 can be attained while thermal stress by expansion and contraction of the silicon gel 6 due to temperature changes can be eased by the moisture impermeable film.</p> |
