| 摘要 |
PROBLEM TO BE SOLVED: To improve noise immunity and resistance to latch-up. SOLUTION: An integrated circuit chip 1, in which an integrated circuit is formed, is mounted on a package substrate 22 to configure a chip scale package CSP. A side of the integrated circuit chip 1 to which the integrated circuit is integrated is directed downward. A conductive metal part 3 is stuck on the opposite side of the integrated circuit chip to the side which the integrated circuit integrated thereto, while having conductivity with respect to a semiconductor substrate 10. A current hardly flows to the semiconductor substrate 10 due to internal causes or due to external disturbances through the presence of the conductive metallic plate 3. Then a potential distribution tends to be hardly generated resulting from of a voltage difference unexpectedly. |
