| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is adaptable to a fine wiring and a multi-layer wiring and has high productivity and a manufacturing method for the wiring board. SOLUTION: In a wiring board 100, a metallic wiring board formed by plating is transferred directly to a base board 110 or a metallic wiring layer on the base board via an insulating portion 120 comprising, from the base board side, an insulating layer 121 and an adhesive layer or via an insulating portion 120 comprising, from the base board side, an adhesive layer, an insulating layer and an adhesive layer, wherein the insulating portion 120 is formed only under the metallic wiring layer and thermal expansion coefficient of the base board is nearly equal to that of the metallic wiring layer. In this case, as for the insulating portion 120, a thermal cracking temperature where the insulating portion 120 reduces its weight by 5% is higher than the highest temperature Tpm among the processing temperature of the insulating layer exposed for manufacturing the wiring board and the processing temperature of the insulating layer exposed for actual use, and in order to prevent the metallic wiring layer 130 from warping when the insulating portion 120 is exposed to temperature below the temperature Tpm, at the temperature below the temperature Tpm, the thermal expansion coefficient of the insulating layer of the insulating portion 120 is nearly equal to the thermal expansion coefficient of the base board 110 of the wiring board. |
