NON-CONTACT IC CARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To highly efficiently manufacture a non-contact IC card low in cost and excellent in mass-productivity and reliability. SOLUTION: A required circuit pattern 3a is formed by etching a foil body or a film body of aluminum provided on an insulating substrate 3b. Conductive adhesive 7 prepared by dispersing metal particles in adhesive is used as a conductive inclusion to connect the circuit pattern 3a to a terminal part on an IC chip 1. At least one part of the metal particles dispersed in the conductive adhesive 7 is brought into contact with a base part of the foil body or the film body by penetrating an oxidation layer generated on the surface of the foil body or the film body. In this manufacturing method, pressurizing force is applied to the circuit patterns placed opposite to each other with the conductive adhesive and the terminal part of the IC chip 1 under room temperature or heat, microstress is actuated on the foil body or the film body and the oxidation layer formed on its surface is destroyed. The method is also applied to connection of the circuit pattern with a bulk coil.