| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card low in cost and excellent in appearance, durability and handleability and to provide a method for manufacturing this kind of IC card with high efficiency. SOLUTION: A bear chip 2 is mounted by flip-chip method on a circuit board 1 in which a required circuit pattern 1 is formed on an insulating substrate 1a. A spacer 5 consisting of hot-melt adhesive is laminated on a surface on which the bear chip is mounted of the circuit board 1. Next, an exterior sheet 4 provided with an adhesive layer 6 consisting of the hot-melt adhesive is laminated on one surface from above the spacer 5 and the circuit board 1 is integrally thermo-compressed with the exterior sheet 4 with the spacer 5 and the adhesive layer 6. After thermo-compression, the spacer 5 is integrated with the adhesive layer 6 to form one-layered adhesive layer. |
