MANUFACTURE OF CHIP PART

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a chip part, in which an outer electrode is formed without generating a recessed shape even when the outer electrode is overlapped partly with a protective film. SOLUTION: The applied thickness of outer-electrode paste (EP) on a protective film is made larger than the other part when the electrode paste (EP) is applied on a chip 1. In a manufacturing step for forming an outer electrode 6 in an overlapped state partly with a second protective film 5, such a recessed part on an outer electrode 6 as in a conventional case can be prevented even when a step is formed between an extraction electrode 2 and the second protective film 5. Then, a symmetrical outline of the outer electrode 6 can be obtained.