| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition extremely high in sensitivity to active light such as i-line and capable of forming a satisfactory pattern by using an alkaline water solution, and a manufacturing method enabling a satisfactory relief pattern to be formed by exposure of active light such as i-line and by development using the alkaline developer. SOLUTION: In a positive photosensitive resin composition including (A) a polyimide precursor having a carboxyl radical or a phenolic hydroxyl radical, and (B) a compound producing an acid by light, the (A) constituent is a mixture of two kinds of polyimide precursors a ratio of whose dissolving speeds is 5 or more in an alkaline water solution, and, in a manufacturing method for a relief pattern, this positive photosensitive resin composition is spread over a substrate, dried, thereafter irradiated with active light, developed by the alkaline water solution, and heated. |
