| 摘要 |
A crack-resistant fabrication method and fabrication apparatus for a semiconductor package prevents interface isolation and cracks by coating a semiconductor chip disposed in a semiconductor package, a paddle of a lead frame, bonding wires and a bond paste using a polyimide type coating material. The coating material forms a coating film to act as a buffering member. The fabrication method can include the steps of attaching a semiconductor chip on a paddle, electrically coupling the semiconductor chip and leads, forming a coating film on the surfaces of the semiconductor chip and the leads, and molding the semiconductor chip, the leads, and the coating film. |
