METHOD AND APPARATUS FOR REDUCING ROUGHNESS SCATTER AS A NOISE SOURCE IN WAFER SCANNING SYSTEMS

摘要

In the optical inspection of polished Si wafers, p-polarized light is incident on the wafer surface and p-polarized light scattered light is detected out of plane at an orientation ( theta s, phi s), where the scattering angles theta s, phi s are selected to minimise the contribution due to surface microroughness.