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发明名称
FORM DIE OF SEMICONDUCTOR PACKAGE
摘要
申请公布号
KR100206974(B1)
申请公布日期
1999.07.01
申请号
KR19960061232
申请日期
1996.12.03
申请人
HYUNDAI MICRO ELECTRONICS CO.,LTD.
发明人
KIM, BYUNG-HO
分类号
H01L23/495;(IPC1-7):H01L23/495
主分类号
H01L23/495
代理机构
代理人
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