发明名称 WIRE BONDING CAPILLARY
摘要 A wire bonding capillary (1) suitable for carrying out long-wire low-loop wiring and capable of reducing wire sliding resistance, comprising a wire insert hole (5), a funnel-shaped hole (3), and an outlet side taper portion (11) of the insert hole (5), the length of the insert hole (5) being set to 0.2-1.5 times as large as a diameter thereof, the taper portion (11) comprising a two-stage taper portion.
申请公布号 WO9933100(A1) 申请公布日期 1999.07.01
申请号 WO1998JP05690 申请日期 1998.12.16
申请人 TOTO LTD.;KABUSHIKI KAISHA SHINKAWA;SUZUKI, TAKESI;SAKURAI, MAMORU;TORIHATA, MINORU;MII, TATSUNARI 发明人 SUZUKI, TAKESI;SAKURAI, MAMORU;TORIHATA, MINORU;MII, TATSUNARI
分类号 B23K20/00;H01L21/607 主分类号 B23K20/00
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