The electronic apparatus housing is provided by a die-casting or molding technique and has an incorporated goods carrier which can be separated from the housing along a defined rupture line, the goods carriers for different types of electronic apparatus housings all having the same dimensions
申请公布号
DE19755240(C1)
申请公布日期
1999.07.01
申请号
DE19971055240
申请日期
1997.12.12
申请人
TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILBRONN, DE
