| 摘要 |
PCT No. PCT/GB94/01519 Sec. 371 Date May 1, 1996 Sec. 102(e) Date May 1, 1996 PCT Filed Jul. 13, 1994 PCT Pub. No. WO95/02509 PCT Pub. Date Jan. 26, 1995A laminate such as a PCB material is formed by stacking resin impregnated prepreg sheets (10) between copper foils (12), applying heat and pressure around the periphery of the stack to form an edge-sealed unit, and subjecting a number of such units to a lay-up process in a separate clean area into which they are introduced via surface-cleaning means. |
| 申请人 |
TEKNEK ELECTRONICS LTD., RENFREWSHIRE, SCOTLAND, GB |
发明人 |
HAMILTON, SHEILA, RENFREWSHIRE PA16 8DN, GB;CANNON, ROY, RENFREWSHIRE PA13 4QG, GB;ROBERTSON, STEWART, KILMACOLM RENFREWSHIRE PA13 4PR, GB;KENNETT, JONATHAN, RENFREWSHIRE PA9 1DH, GB |
