| 摘要 |
The present invention provides a method of determining an order of wire-bonding between a plurality of leads and a plurality of electrodes, the leads being arranged in two arrays, the electrodes being disposed intermediate between the two arrays of leads in a line on a semiconductor, the method including the steps of (a) surveying whether, if a first wire for connecting a first electrode to a first lead is extended beyond the first electrode, the extended first wire would intersect with a second wire for connecting a second electrode to a second lead, and (b) carrying out wire-boding for the first wire and then wire-bonding for the second wire if the extended first wire would intersect with the second wire. |
