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发明名称
LEAD FRAME FOR HEAT DISSIPATING
摘要
申请公布号
KR200146684(Y1)
申请公布日期
1999.07.01
申请号
KR19950047438U
申请日期
1995.12.26
申请人
HYUNDAI MICRO ELECTRONICS CO.,LTD.
发明人
LEE, HYUN-IL;YOU, YOUNG-HEUN
分类号
H01L23/495;(IPC1-7):H01L23/495
主分类号
H01L23/495
代理机构
代理人
主权项
地址
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