DIE BONDING METHOD OF SEMICONDUCTOR PACKAGE,申请号KR19960045656-传众专利搜索

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发明名称	DIE BONDING METHOD OF SEMICONDUCTOR PACKAGE
摘要
申请公布号	KR100206944(B1)	申请公布日期	1999.07.01
申请号	KR19960045656	申请日期	1996.10.14
申请人	HYUNDAI MICRO ELECTRONICS CO.,LTD.	发明人	JO, JAE-WON;HO, SEONG-JAE
分类号	H01L21/52;(IPC1-7):H01L21/52	主分类号	H01L21/52
代理机构		代理人
主权项
地址

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