| 发明名称 |
Device and process for interconnecting between two electronic devices |
| 摘要 |
The intermediate connection board has upper contact points, connecting to the electronic component. There are conducting grooves formed in the side walls, which connect to the lower printed circuit board and are interconnected to the electronic component after pad connection has taken place. |
| 申请公布号 |
EP0926935(A1) |
申请公布日期 |
1999.06.30 |
| 申请号 |
EP19980403209 |
申请日期 |
1998.12.18 |
| 申请人 |
AEROSPATIALE SOCIETE NATIONALE INDUSTRIELLE |
发明人 |
BEDOS, JEAN-PHILIPPE;SUNE, GERARD |
| 分类号 |
H05K1/11;H05K1/14;H05K3/00;H05K3/34;H05K3/36;H05K3/40;H05K3/42 |
主分类号 |
H05K1/11 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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