Surface-acoustic-wave device

摘要

A surface acoustic wave device comprises a surface-acoustic-wave element 1 with interdigital electrodes 15 on a piezoelectric substrate 10 packaged in a package 20,25. A suitable part of the package, e.g. the lid 20, is provided with a metal pattern 10, and corresponding metal bumps 11a, 11b, 11c are formed on a bonding pad section of the surface-wave-device element. The metal bumps 11 are thus contact-connected with the metal pattern 21 of the package, reducing its size and making it more reliable compared to the conventional wire-bonded package.