发明名称 WIRING BOARD HAVING VIAS
摘要 <p>There is provided a wiring board comprising vias which penetrate the wiring board from one side to the other side, the vias being radially arranged in the direction from one side to the other side so that the interval between the vias on one side can be made smaller than the interval between the vias on the other side. In order to prevent the vias from being electrically short-circuited to each other, even if the interval between the vias provided on one side of the wiring board is extremely reduced, a plurality of vias 12, 12, . . are radially arranged in the direction from one side 10a of the wiring board 10 to the other side 10b so that an interval (Wa) between the vias on one side 10a of the wiring board 10 can be made smaller than interval (Wc) of the vias on the other side 10b, and a conductor forming the core portion 14 of the via 12 is coated with the sheath portion 16 made of insulating material. <IMAGE></p>
申请公布号 EP0926931(A1) 申请公布日期 1999.06.30
申请号 EP19980914051 申请日期 1998.04.16
申请人 SHINKO ELECTRIC INDUSTRIES CO. LTD. 发明人 HORIUCHI, MICHIO;SUYAMA, TOSHIAKI;TOKITA, MASAKUNI
分类号 H05K1/11;H05K3/44;H01L23/498;H05K3/40;H05K3/46;(IPC1-7):H05K1/11 主分类号 H05K1/11
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