Electronic circuit apparatus and method for assembling the same

摘要

A plurality of ceramic circuit boards (10) mounted with heat-generative driving transistors (21) and other electronic parts (22) are bonded to a heat radiating fin (40), and the heat radiating fin (40) is connected to a motherboard (60). Heat generated by the driving transistors (21) can efficiently be absorbed and dissipated by the heat radiating fin (40), and assembling work necessary for combining the components to the motherboard (60) can be reduced. The electronic parts (21, 22), wiring patterns and the like on the circuit boards (10) can simultaneously be encapsulated in a resin or the like after bonding the circuit boards (10) to the heat radiating fin (40), packaging work can be reduced.