发明名称 METALLIC WIRE CLEANING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a metallic wire cleaning device capable of removing the oxidized film on a surface with simple constitution. SOLUTION: The cleaning device 10 for a metallic wire, such as wire solder 12, has a peeling means, such as wire brush, for mechanically peeling the oxidized film on the metallic wire surface and a means for cleaning the surface of the metallic wire by a detergent, such as org. solvent. If this device is applied to the cleaning of the wire solder 12, the oxidized film of the wire solder just prior to the use for soldering may be automatically and surely removed and the improvement in soldering work efficiency and the improvement in the reliability of soldering are resulted.
申请公布号 JPH11170038(A) 申请公布日期 1999.06.29
申请号 JP19970342889 申请日期 1997.12.12
申请人 SONY CORP 发明人 SATO TAMOTSU
分类号 B08B9/023;B08B3/08;B08B9/02;B23K1/20;B23K3/06 主分类号 B08B9/023
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