发明名称 LOW ELASTIC RESIN COMPOSITION, LOW ELASTIC RESIN HARDENED MATERIAL AND ELECTRONIC EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To obtain a low elastic resin composition capable of realizing the compatibility of low elasticity after hardening and environmental resistance and a low elastic resin hardened material obtained by hardening the composition, and to provide an electronic equipment using the hardened material. SOLUTION: This composition composed of a main component A comprising a polyglycidyl ether-type epoxy, a main component B comprising a polyglycidyl ether-type epoxy, and a hardener in an amount of 1.5-15 times by equivalent in terms of an active hydrogen based on the total epoxy equivalent of the main components A and B and/or a hardening catalyst of 50-300 mol.% based on the total epoxy equivalent of the main components A and B. The hardening reactions not only of the main component A but also of the main component B are completed by adding a large excess of the hardener or the hardening catalyst.</p>
申请公布号 JPH11171971(A) 申请公布日期 1999.06.29
申请号 JP19970362651 申请日期 1997.12.12
申请人 DENSO CORP 发明人 ECHIGO SUSUMU
分类号 C08G59/18;C08G59/20;C08G59/50;C08G59/68;H01L21/52;H01L23/29;H01L23/31;(IPC1-7):C08G59/18 主分类号 C08G59/18
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