Packaging system for field effects transistors

摘要

A packaging system for field effect transistor ("FET") dies is described. Individual FET dies are eutectically bonded to individual FET mounting bars. The mounting bar/FET die combination is then eutectically bonded, along with the other components comprising the package, to a package base. After a wiring operation, the package is completed by sealing it with a cover. This packaging system has many fewer parts than known FET packages, permits the economical correction of micro-voids between the FET dies and the mounting bars, and is significantly less expensive than known FET packages.