发明名称 |
Flexible circuit board interconnect with strain relief |
摘要 |
A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof. The vias are arranged to be offset from the vias on adjacent conductor strips such that a perforation-type tear line is avoided and such that when a hot bar soldering is used, at least one via remains uncovered for receiving soldering wicking, thus reducing the likelihood of solder bridging across conductor strips.
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申请公布号 |
US5917149(A) |
申请公布日期 |
1999.06.29 |
申请号 |
US19970856713 |
申请日期 |
1997.05.15 |
申请人 |
DAIMLERCHRYSLER CORPORATION |
发明人 |
BARCLEY, TINA;ROTH, NORMAN J.;GERMANSKI, VASIL;POKRIEFKA, EDWARD T.;ISOLA, ROBERT A. |
分类号 |
H05K1/02;H05K1/11;H05K3/34;H05K3/36;(IPC1-7):H05K9/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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