| 摘要 |
In a chemical-mechanical-polishing (CMP) process, semiconductor substrates are rotated against a polishing pad covered by a layer of polishing slurry. A polishing pad maintenance apparatus is developed to reduce glazing effects, enhance the pad's operating life, achieve uniform planarity through a constant polishing rate, and minimize scratches or other defects from the polished surface, during a chemical-mechanical polishing process. This invention combines both the removal of particles and debris while effectively conditioning the pad surface. The polishing pad maintenance apparatus performs three main functions: loosening particles and debris; conditioning the polishing pad; and, removing the remaining particles and debris that result from the slurry and conditioning processes. The three functions are performed in sequence by a forced fluid spray, an abrasive mechanical agitator, and a vacuum. A conditioning housing assembly supports the three components that perform the maintenance functions: a) a forced fluid spray assembly; b) a mechanically abrasive plate; and, c) a vacuum attachment assembly.
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