发明名称 |
Minimal capture pads applied to ceramic vias in ceramic substrates |
摘要 |
A device includes a ceramic substrate. A ceramic via is defined within the ceramic substrate at an actual location which differs from a designed desired location for the ceramic via. A minimal capture pad electrically communicates the actual location with the designed desired location. The minimal capture pad contains a ceramic via contact portion, a thin film stud contact portion, and a connecting portion; and each of the three is configured to be as small as permitted to limit the capacitances produced by the capture pad.
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申请公布号 |
US5916451(A) |
申请公布日期 |
1999.06.29 |
申请号 |
US19950450113 |
申请日期 |
1995.05.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
PERFECTO, ERIC DANIEL;PRASAD, CHANDRIKA;PRASAD, KESHAV;ROBBINS, GORDON JAY;SWAMINATHAN, MADHAVAN;WHITE, GEORGE EUGENE |
分类号 |
H01L23/538;H05K1/03;H05K1/11;H05K3/40;H05K3/46;(IPC1-7):H01B13/00 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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