发明名称 |
Tamper-proof electronic coatings |
摘要 |
Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
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申请公布号 |
US5916944(A) |
申请公布日期 |
1999.06.29 |
申请号 |
US19970939833 |
申请日期 |
1997.09.29 |
申请人 |
DOW CORNING CORPORATION |
发明人 |
CAMILLETTI, ROBERT CHARLES;HALUSKA, LOREN ANDREW;MICHAEL, KEITH WINTON |
分类号 |
C01B33/12;C03C17/00;C03C17/34;C04B41/50;C04B41/87;C09D183/04;C09D183/05;C09K11/02;C14C11/00;C23C18/12;H01L23/58;(IPC1-7):C08K5/04 |
主分类号 |
C01B33/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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