发明名称 Semiconductor device socket
摘要 A semiconductor device test socket for connecting an external circuit to external leads of a semiconductor device to permit testing of the semiconductor device includes a body having a positioning base for supporting roots of external leads of a semiconductor device to be tested. A plurality of movable contact terminals are supported by the body and disposed opposite to the external leads of the semiconductor device when the semiconductor device is supported by the positioning base. The contact terminals are movable between a first position electrically contacting the external leads and a second position spaced from the external leads. The contact terminals are configured so as to be moved to their second positions when a conveyance tool for supporting the semiconductor device to be tested is moved towards the test socket and pressed against the contact terminals, and so as to move to their first positions when the conveyance tool is moved away from the test socket out of contact with the contact terminals.
申请公布号 US5917240(A) 申请公布日期 1999.06.29
申请号 US19970923254 申请日期 1997.09.04
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 IDETA, YASUSHI;WASHITANI, AKIHIRO;UMETSU, TSUNENORI;KANEKO, KEIKO;KOBAYASHI, KUNIO
分类号 G01R31/26;H01L23/32;H01R33/76;H01R33/965;H05K7/10;(IPC1-7):H01L23/34 主分类号 G01R31/26
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