A profile measuring apparatus provided with an improved probe for measuring profiles throughout a wide area of the surface of an object with a high level of response and high accuracy. The probe 10 comprises an arm 3 having a stylus 1 fixedly mounted to the distal end thereof, which is coupled to a stationary part 11 of the apparatus by an arm holding member 5 made of a V-shaped leaf spring in such a way that the arm 3 is tilted in one axial direction by a contact pressure exerted thereto during measurement. Displacement of the arm 3 is thereby detected through measuring an elastic deformation of the leaf spring caused by the contact pressure exerted to the stylus 1 being pressed against the surface to be measured.
