| 摘要 |
PROBLEM TO BE SOLVED: To obtain a die attach paste for semiconductor which has excellent adhesiveness, low stress property and solder crack resistance, and further can be cured in a very short time. SOLUTION: This die attach paste is obtained by including (A) a product by the reaction of a phosphoric acid group-containing acrylate and/or a phosphoric acid group-containing methacrylate shown by formula I with an alicylclic epoxy group-containing alkoxysilane and a monoacrylate by formula IIA or a monomethacrylate shown by formula IIB at 0-50 deg.C, (B) a urethane diacrylate obtained by the reaction of a hydroxyalkyl acrylate with a polyalkylene glycol and a diisocyanate, (C) an initiator, and (D) silver powder, wherein R is H or CH3 , (a) is 0 or 1, (b) and (c) are each 1 or 2, (b)+(c)=3, and R1 is group containing alicyclic and/or aromatic group(s) and having ten carbon atoms or more. |
