发明名称 RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
摘要 PROBLEM TO BE SOLVED: To obtain a resin compsn. improved in mechanical properties and stability by using an epoxy resin as the base resin and by incorporating a filler (e.g. fused silica) and an aminosilane coupling agent into the same. SOLUTION: This compsn. is prepd. by dispersing 100 pts.wt. epoxy resin, a cure catalyst (e.g. 1-benzyl-2-phenylimidazole), 170-190 pts.wt. filler (e.g. fused silica having an average particle size of 1-20μm), an aminosilane coupling agent (e.g.γ-aminopropyltrimethoxysilane) in an amt. of 0.8-1.2 wt.% of the filler, and optionally a flexibilizer, another inorg. filler, an antifoaming agent, a flame retardant, etc., in a solvent (e.g. propylene glycol methyl ether acetate). The epoxy resin pref. comprises a dicyclopentadiene epoxy resin and a brominated novolak epoxy resin in a wt. ratio of (60/40)-(50/50), and pref., the compsn. is compounded, as the other resin component, with a dicyclopentadiene phenol resin in an amt. of 50-70 wt.% based on 100 wt.pts. of the epoxy resin.
申请公布号 JPH11172077(A) 申请公布日期 1999.06.29
申请号 JP19970341557 申请日期 1997.12.11
申请人 TOSHIBA CHEM CORP 发明人 KIKUCHI MIEKO
分类号 C08K3/36;C08K5/54;C08K5/544;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08K3/36
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