发明名称
摘要 PURPOSE:To improve the stability of second bonding using a coated wire by connecting the coated wire to an inner lead on a lead frame by using a capillary or the lead frame having a recessed surface against the connecting surface at the time of performing the second bonding for connecting the coated wire to the inner lead. CONSTITUTION:A capillary 2 is made of ceramic or ruby and has a crater-like shape 2b around a wire lead-out hole 2a at its front end face from which a wire is led out. Because of the crater-like shape 2b at the front end face of the capillary 2, a sufficiently high strength of the wire can be ensured even when the wire become thicker in thickness on the inside of a joining section. Since the wire strength can be ensured at the joining section even when the output of ultrasonic waves is increased, a sufficiently high joining strength can be ensured and, at the same time, the amount of the wire fed can be stabilized. Therefore, the occurrence of defective bonding resulting from ball formation can be prevented.
申请公布号 JP2912128(B2) 申请公布日期 1999.06.28
申请号 JP19930199836 申请日期 1993.08.12
申请人 NIPPON DENKI KK 发明人 ONO YOSHIHIRO
分类号 H01L21/60;H01L23/50 主分类号 H01L21/60
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