发明名称
摘要 In order to mount a power transistor chip, a multilayered member formed by fixing a molybdenum plate to a copper base is flattened by eliminating its deformation in the member caused by heated fixing through elastic working, it is possible to prevent cracking in a power transistor chip or a solder layer caused by the deformation. Especially, it is possible to improve the reliability of an electronic distributing type ignition device mounted on an engine block formed in a unit of an ignition controller and an ignition coil.
申请公布号 JP2912991(B2) 申请公布日期 1999.06.28
申请号 JP19930201383 申请日期 1993.08.13
申请人 HITACHI SEISAKUSHO KK 发明人 MORYAMA NORIO;SUGIURA NOBORU
分类号 F02P7/03;F02P3/02;F02P15/00;H01L23/36;H01T13/44;(IPC1-7):F02P15/00 主分类号 F02P7/03
代理机构 代理人
主权项
地址