PLATING DEVICE AND METHOD OF CONFIRMING CURRENT FEED

摘要

There are provided an electrical contact sensing means for sensing the electrical contact of current feed contacts with a current feed part of a substrate to be plated, and a plating device for forming a plating film with a uniform thickness by uniforming the plating current flowing through the current feed contacts. In the plating device, an anode (13) and a substrate (12) to be plated attached to a plating member are opposed in a plating bath, and the plating member has current feed contacts (15) in contact with the current feed part provided on the substrate. A predetermined voltage is applied between the current feed contacts (15) and the anode (13) to feed a plating current through the current feed contacts. Thus the substrate (12) is plated. The plating device includes an electrical contact sensing means (22) for sensing the electrical contact of the current feed contacts of the plating member with the current feed part of the substrate (12).