Preparation of absorber material comprises a first stage of reacting a silicon hydride-containing curing agent and an excess of polyorganosiloxane and then forming a cured addition-crosslinked silicone rubber in a second stage. Preparation of absorber materials comprises reacting a silicon hydride-containing curing agent and an excess of polyorganosiloxane and then forming a cured addition-crosslinked silicone rubber. Independent claims are included for: (1) an absorber material comprising the above material; and (2) a semiconductor arrangement comprising a semiconductor hermetically sealed in a housing comprising the above material as damping agent.
