Hybrid circuit arrangement

摘要

According to the invention, a thermal release (6) is electrically connected to a resistance meander (1) and can be triggered by said meander (1) in the case of an overload when the circuit substrate (5) heats up. The resistance meander (1) is embodied in a defined area (4) on the circuit support as a multiple interlaced structure surrounding the hot spot (3) which is to be produced in an optimised manner and in a defined position. The thermal release is thermally coupled to the circuit substrate (5) at said hot spot (3).