DIAMOND-BASED COMPOSITES WITH HIGH THERMAL CONDUCTIVITY

摘要

A diamond based composite comprising diamond powder distributed in a non-metallic matrix material, the filling factor being between about 15 % and about 75 % and the conductivity of the comprising being substantially greater than the conductivity of the matrix material without diamond. The composite is dielectric and can include magnetic or fibrous materials. It can be used in biochips, electronic devices, and residential and industrial materials where thermal load management is critical.