发明名称 |
WATER BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS |
摘要 |
A water deposition bath is used for homogeneous electrolytic deposition of copper coatings, more particularly, on printed boards. Said bath contains at least one copper ion source, at least one compound enhancing the electric conductivity of the deposition bath and at least one additive. The additive contains at least one conversion product, formed by epihalogenohydrins, dihalogenohydrins or 1-halogen-2,3-propanediols and polyamidoamines. The polyamidoamines are formed by condensation reaction of dicarboxylic acids with polyalkylene polyamines. Copper coatings with homogenous coating thickness can be deposited using said bath. |
申请公布号 |
WO9931300(A2) |
申请公布日期 |
1999.06.24 |
申请号 |
WO1998DE03783 |
申请日期 |
1998.12.17 |
申请人 |
ATOTECH DEUTSCHLAND GMBH;DAHMS, WOLFGANG;JONAT, MICHAEL;SENGE, GERD;NITSCHE, DETLEV |
发明人 |
DAHMS, WOLFGANG;JONAT, MICHAEL;SENGE, GERD;NITSCHE, DETLEV |
分类号 |
C08G73/02;C25D3/38;C25D7/00 |
主分类号 |
C08G73/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|